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Berriah, O., Bougataya, M., Lakhssassi, A., Blaquiere, Y., & Savaria, Y. (juin 2010). Thermal analysis of a miniature electronic power device matched to a silicon wafer [Communication écrite]. 8th IEEE International NEWCAS Conference (NEWCAS 2010), Montréal, Québec. Lien externe
Bougataya, M., Lakhasasi, A., Savaria, Y., & Massicotte, D. (mai 2004). Thermo-mechanical stress analysis of VLSI devices by partially coupled finite element method [Communication écrite]. 18th Annual Canadian Conference on Electrical and Computer Engineering (CCEC 2004), Niagara Falls, Ontario. Lien externe
Bougataya, M., Lakhsasi, A., Savaria, Y., & Massicotte, D. (janvier 2003). Stress and distortion behavior for VLSI steady state thermal analysis [Communication écrite]. Canadian Conference on Electrical and Computer Engineering (CCECE 2003). Lien externe
