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Gesn Bonding Technology for Integrated Laser-on-Chip Photonics

James Zi Jing Tan, Daniel Burt, Young-Min Kim, Hyo-Jun Joo, Melvina Chen, Xuncheng Shi, Lin Zhang, Chuan Seng Tan, Kenneth Yang Teck Lim, Elgin Quek, Yi-Chiau Huang, Simone Assali, Oussama Moutanabbir and Donguk Nam

Article (2022)

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Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/55577/
Journal Title: Meeting abstracts (vol. MA2022-02, no. 32)
Publisher: Electrochemical Society
DOI: 10.1149/ma2022-02321177mtgabs
Official URL: https://doi.org/10.1149/ma2022-02321177mtgabs
Date Deposited: 19 Sep 2023 15:36
Last Modified: 05 Apr 2024 12:02
Cite in APA 7: Tan, J. Z. J., Burt, D., Kim, Y.-M., Joo, H.-J., Chen, M., Shi, X., Zhang, L., Tan, C. S., Lim, K. Y. T., Quek, E., Huang, Y.-C., Assali, S., Moutanabbir, O., & Nam, D. (2022). Gesn Bonding Technology for Integrated Laser-on-Chip Photonics. Meeting abstracts, MA2022-02(32), 1177-1177. https://doi.org/10.1149/ma2022-02321177mtgabs

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