James Zi Jing Tan, Daniel Burt, Young-Min Kim, Hyo-Jun Joo, Melvina Chen, Xuncheng Shi, Lin Zhang, Chuan Seng Tan, Kenneth Yang Teck Lim, Elgin Quek, Yi-Chiau Huang, Simone Assali, Oussama Moutanabbir
and Donguk Nam
Article (2022)
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| Department: | Department of Engineering Physics |
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| PolyPublie URL: | https://publications.polymtl.ca/55577/ |
| Journal Title: | Meeting abstracts (vol. MA2022-02, no. 32) |
| Publisher: | Electrochemical Society |
| DOI: | 10.1149/ma2022-02321177mtgabs |
| Official URL: | https://doi.org/10.1149/ma2022-02321177mtgabs |
| Date Deposited: | 19 Sep 2023 15:36 |
| Last Modified: | 25 Sep 2024 16:47 |
| Cite in APA 7: | Tan, J. Z. J., Burt, D., Kim, Y.-M., Joo, H.-J., Chen, M., Shi, X., Zhang, L., Tan, C. S., Lim, K. Y. T., Quek, E., Huang, Y.-C., Assali, S., Moutanabbir, O., & Nam, D. (2022). Gesn Bonding Technology for Integrated Laser-on-Chip Photonics. Meeting abstracts, MA2022-02(32), 1177-1177. https://doi.org/10.1149/ma2022-02321177mtgabs |
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