Amir H. Nobari, Sylvain St-Laurent, Yannig Thomas, Arslane Bouchemit and Gilles L'Espérance
Paper (2018)
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| Department: | Department of Mathematics and Industrial Engineering |
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| ISBN: | 9781538649992 |
| PolyPublie URL: | https://publications.polymtl.ca/41411/ |
| Conference Title: | 68th IEEE Electronic Components and Technology Conference (ECTC 2018) |
| Conference Location: | San Diego, CA |
| Conference Date(s): | 2018-05-29 - 2018-06-01 |
| Publisher: | IEEE |
| DOI: | 10.1109/ectc.2018.00291 |
| Official URL: | https://doi.org/10.1109/ectc.2018.00291 |
| Date Deposited: | 18 Apr 2023 15:03 |
| Last Modified: | 08 Apr 2025 12:22 |
| Cite in APA 7: | Nobari, A. H., St-Laurent, S., Thomas, Y., Bouchemit, A., & L'Espérance, G. (2018, May). Performance of fine and ultra-fine lead-free powders for solder paste applications [Paper]. 68th IEEE Electronic Components and Technology Conference (ECTC 2018), San Diego, CA. https://doi.org/10.1109/ectc.2018.00291 |
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