 | Up a level |
Nobari, A. H., St-Laurent, S., Thomas, Y., Bouchemit, A., & L'Espérance, G. (2018, May). Performance of fine and ultra-fine lead-free powders for solder paste applications [Paper]. 68th IEEE Electronic Components and Technology Conference (ECTC 2018), San Diego, CA. External link
Xu, C., Therriault, D., Laberge Lebel, L., L'Espérance, G., & Bouchemit, A. (2019). 3D printing of metallic inks and subsequent heat-treatments. (Patent Application no. US20190054536). External link
Xu, C., Bouchemit, A., L'Espérance, G., Laberge Lebel, L., & Therriault, D. (2017). Solvent-cast based metal 3D printing and secondary metallic infiltration. Journal of Materials Chemistry C, 5(40), 10448-10455. External link
