A. Fourmigue, Giovanni Beltrame
and Gabriela Nicolescu
Article (2016)
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| Department: | Department of Computer Engineering and Software Engineering |
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| Research Center: | GR2M - Microelectronics and Microsystems Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/36356/ |
| Journal Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 6, no. 9) |
| Publisher: | IEEE |
| DOI: | 10.1109/tcpmt.2016.2599100 |
| Official URL: | https://doi.org/10.1109/tcpmt.2016.2599100 |
| Date Deposited: | 18 Apr 2023 15:05 |
| Last Modified: | 25 Sep 2024 16:20 |
| Cite in APA 7: | Fourmigue, A., Beltrame, G., & Nicolescu, G. (2016). Transient thermal simulation of liquid-cooled 3-D circuits. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6(9), 1349-1360. https://doi.org/10.1109/tcpmt.2016.2599100 |
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