Zhang Jing, Zhang Xiupu, Shen Dongya, Liu Taijun and Ke Wu
Article (2015)
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| Department: | Department of Electrical Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/34523/ |
| Journal Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 5, no. 12) |
| Publisher: | IEEE |
| DOI: | 10.1109/tcpmt.2015.2489923 |
| Official URL: | https://doi.org/10.1109/tcpmt.2015.2489923 |
| Date Deposited: | 18 Apr 2023 15:07 |
| Last Modified: | 08 Apr 2025 06:55 |
| Cite in APA 7: | Jing, Z., Xiupu, Z., Dongya, S., Taijun, L., & Wu, K. (2015). Gap waveguide-based PMC packaging for via holes-caused nonsmooth PEC surface. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5(12), 1828-1838. https://doi.org/10.1109/tcpmt.2015.2489923 |
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