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Items where Author is "Taijun, Liu"

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Jing, Z., Xiupu, Z., Dongya, S., Taijun, L., & Wu, K. (2015). Gap waveguide-based PMC packaging for via holes-caused nonsmooth PEC surface. IEEE Transactions on Components, Packaging and Manufacturing Technology, 5(12), 1828-1838. External link

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