Th. Clin, Sylvain Turenne, Dimitri Vasilevskiy and Rémo A. Masut
Paper (2008)
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| Department: |
Department of Engineering Physics Department of Mechanical Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/19765/ |
| Conference Title: | 27th International Conference on Thermoelectrics |
| Conference Location: | Corvallis, Oregon |
| Conference Date(s): | 2008-08-03 - 2008-08-07 |
| Journal Title: | Journal of Electronic Materials (vol. 38, no. 7) |
| Publisher: | Springer |
| DOI: | 10.1007/s11664-009-0756-9 |
| Official URL: | https://doi.org/10.1007/s11664-009-0756-9 |
| Date Deposited: | 18 Apr 2023 15:14 |
| Last Modified: | 08 Apr 2025 02:06 |
| Cite in APA 7: | Clin, T., Turenne, S., Vasilevskiy, D., & Masut, R. A. (2008, August). Numerical simulation of the thermomechanical behavior of extruded bismuth telluride alloy module [Paper]. 27th International Conference on Thermoelectrics, Corvallis, Oregon. Published in Journal of Electronic Materials, 38(7). https://doi.org/10.1007/s11664-009-0756-9 |
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