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Numerical simulation of the thermomechanical behavior of extruded bismuth telluride alloy module

Th. Clin, Sylvain Turenne, Dimitri Vasilevskiy and Rémo A. Masut

Paper (2008)

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Department: Department of Engineering Physics
Department of Mechanical Engineering
PolyPublie URL: https://publications.polymtl.ca/19765/
Conference Title: 27th International Conference on Thermoelectrics
Conference Location: Corvallis, Oregon
Conference Date(s): 2008-08-03 - 2008-08-07
Journal Title: Journal of Electronic Materials (vol. 38, no. 7)
Publisher: Springer
DOI: 10.1007/s11664-009-0756-9
Official URL: https://doi.org/10.1007/s11664-009-0756-9
Date Deposited: 18 Apr 2023 15:14
Last Modified: 08 Jun 2023 11:27
Cite in APA 7: Clin, T., Turenne, S., Vasilevskiy, D., & Masut, R. A. (2008, August). Numerical simulation of the thermomechanical behavior of extruded bismuth telluride alloy module [Paper]. 27th International Conference on Thermoelectrics, Corvallis, Oregon. Published in Journal of Electronic Materials, 38(7). https://doi.org/10.1007/s11664-009-0756-9

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