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Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board

Mamadou D. Diop, Moufid Radji, Walder André, Yves Blaquière, Anas A. Hamoui and Ricardo Izquierdo

Paper (2010)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/16977/
Conference Title: IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
Conference Location: Austin, TX, United states
Conference Date(s): 2010-10-25 - 2010-10-27
Publisher: IEEE Computer Society
DOI: 10.1109/epeps.2010.5642596
Official URL: https://doi.org/10.1109/epeps.2010.5642596
Date Deposited: 18 Apr 2023 15:12
Last Modified: 05 Apr 2024 10:58
Cite in APA 7: Diop, M. D., Radji, M., André, W., Blaquière, Y., Hamoui, A. A., & Izquierdo, R. (2010, October). Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board [Paper]. IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, Austin, TX, United states. https://doi.org/10.1109/epeps.2010.5642596

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