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Inverted interconnect between substrate integrated waveguide and coplanar waveguide

Farzaneh Taringou, J. Bornemann and Ke Wu

Paper (2013)

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Department: Department of Electrical Engineering
ISBN: 9781467361774
PolyPublie URL: https://publications.polymtl.ca/13050/
Conference Title: IEEE MTT-S International Microwave Symposium (IMS 2013)
Conference Location: Seattle, Wash., USA
Conference Date(s): 2013-06-02 - 2013-06-07
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/mwsym.2013.6697343
Official URL: https://doi.org/10.1109/mwsym.2013.6697343
Date Deposited: 18 Apr 2023 15:10
Last Modified: 08 Apr 2025 12:20
Cite in APA 7: Taringou, F., Bornemann, J., & Wu, K. (2013, June). Inverted interconnect between substrate integrated waveguide and coplanar waveguide [Paper]. IEEE MTT-S International Microwave Symposium (IMS 2013), Seattle, Wash., USA. https://doi.org/10.1109/mwsym.2013.6697343

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