Farzaneh Taringou, J. Bornemann and Ke Wu
Paper (2013)
An external link is available for this item| Department: | Department of Electrical Engineering |
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| ISBN: | 9781467361774 |
| PolyPublie URL: | https://publications.polymtl.ca/13050/ |
| Conference Title: | IEEE MTT-S International Microwave Symposium (IMS 2013) |
| Conference Location: | Seattle, Wash., USA |
| Conference Date(s): | 2013-06-02 - 2013-06-07 |
| Publisher: | Institute of Electrical and Electronics Engineers |
| DOI: | 10.1109/mwsym.2013.6697343 |
| Official URL: | https://doi.org/10.1109/mwsym.2013.6697343 |
| Date Deposited: | 18 Apr 2023 15:10 |
| Last Modified: | 08 Apr 2025 12:20 |
| Cite in APA 7: | Taringou, F., Bornemann, J., & Wu, K. (2013, June). Inverted interconnect between substrate integrated waveguide and coplanar waveguide [Paper]. IEEE MTT-S International Microwave Symposium (IMS 2013), Seattle, Wash., USA. https://doi.org/10.1109/mwsym.2013.6697343 |
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