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Dousset, D., Bornemann, J., Daigle, M., Claude, S., & Wu, K. (octobre 2012). Broadband 100 GHz substrate-integrated waveguide couplers with irregularly shaped via holes for higher-order mode suppression [Communication écrite]. 42th European Microwave Conference Proceeding (EuMC 2012), Amsterdam, Netherlands. Lien externe
Tarringou, F., Bornemann, J., & Wu, K. (novembre 2013). Experimental verification of coplanar-to-substrate-integrated-waveguide interconnect on low-permittivity substrate [Communication écrite]. Asia-Pacific Microwave Conference (APMC 2013), Seoul, Korea. Lien externe
Taringou, F., Bornemann, J., & Wu, K. (juin 2013). Inverted interconnect between substrate integrated waveguide and coplanar waveguide [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2013), Seattle, Wash., USA. Lien externe
