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Dousset, D., Bornemann, J., Daigle, M., Claude, S., & Wu, K. (2012, October). Broadband 100 GHz substrate-integrated waveguide couplers with irregularly shaped via holes for higher-order mode suppression [Paper]. 42th European Microwave Conference Proceeding (EuMC 2012), Amsterdam, Netherlands. External link
Tarringou, F., Bornemann, J., & Wu, K. (2013, November). Experimental verification of coplanar-to-substrate-integrated-waveguide interconnect on low-permittivity substrate [Paper]. Asia-Pacific Microwave Conference (APMC 2013), Seoul, Korea. External link
Taringou, F., Bornemann, J., & Wu, K. (2013, June). Inverted interconnect between substrate integrated waveguide and coplanar waveguide [Paper]. IEEE MTT-S International Microwave Symposium (IMS 2013), Seattle, Wash., USA. External link
