Broadband interconnects between coplanar waveguide and substrate integrated waveguide for dense packaging and integration

Farzaneh Taringou, Jens Bornemann, Ke Wu and Thomas Weiland

Paper (2014)

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Department:	Department of Electrical Engineering
ISBN:	9781479938698
PolyPublie URL:	https://publications.polymtl.ca/11509/
Conference Title:	IEEE MTT-S International Microwave Symposium (IMS 2014)
Conference Location:	Tampa Bay, Florida, USA
Conference Date(s):	2014-06-01 - 2014-06-06
Publisher:	IEEE
DOI:	10.1109/mwsym.2014.6848354
Official URL:	https://doi.org/10.1109/mwsym.2014.6848354
Date Deposited:	18 Apr 2023 15:08
Last Modified:	08 Apr 2025 12:20

Cite in APA 7:	Taringou, F., Bornemann, J., Wu, K., & Weiland, T. (2014, June). Broadband interconnects between coplanar waveguide and substrate integrated waveguide for dense packaging and integration [Paper]. IEEE MTT-S International Microwave Symposium (IMS 2014), Tampa Bay, Florida, USA. https://doi.org/10.1109/mwsym.2014.6848354
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