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Identification of constitutive theory parameters using a tensile machine for deposited filaments of microcrystalline ink by the direct-write method

Nicolas Lourdel, Daniel Therriault, Martin Lévesque

Article (2009)

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Abstract

A custom-designed tensile machine is developped to characterize the10 mechanical properties of ink micro-filaments deposited by Direct-Write method. The11 Direct-Write method has been used for the fabrication of a wide variety of micro12systems such as microvascular networks, chaotic mixers and laboratory on-chips. The13 tensile machine was used to measure the induced force in ink filaments during tensile14 and tension-relaxation tests as a function of the applied strain rate, the ink composition15 and the filament diameter. Experimental data was fitted by a linearly viscoelastic16 model using a data reduction procedure in order to identify the constitutive theory17 parameters of the deposited ink filaments. The model predictions based on the defined18 constitutive theory parameters were closed to the experimental data generated in this19 study. Such models will be useful in the development and optimization of future 3D20 complex structures made by direct-write method.
Subjects: 1700 Design and manufacturing > 1702 Advanced manufacturing
2000 Materials science and technology > 2002 Materials processing/fabrication
Department: Department of Mechanical Engineering
Research Center: CREPEC - Center for Applied Research on Polymers and Composites
Funders: CRSNG/NSERC
PolyPublie URL: https://publications.polymtl.ca/10381/
Journal Title: Journal of Micromechanics and Microengineering (vol. 19, no. 9)
Publisher: IOP Publishing Ltd
DOI: 10.1088/0960-1317/19/9/095017
Official URL: https://doi.org/10.1088/0960-1317/19/9/095017
Date Deposited: 06 Jul 2022 14:36
Last Modified: 17 Nov 2022 08:43
Cite in APA 7: Lourdel, N., Therriault, D., & Lévesque, M. (2009). Identification of constitutive theory parameters using a tensile machine for deposited filaments of microcrystalline ink by the direct-write method. Journal of Micromechanics and Microengineering, 19(9), 095017 (7 pages). https://doi.org/10.1088/0960-1317/19/9/095017

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