 | Monter d'un niveau |
Bougataya, M., Lakhsasi, A., Norman, R., Prytula, R., Blaquière, Y., & Savaria, Y. (mai 2008). Steady state thermal analysis of a reconfigurable wafer-scale circuit board [Communication écrite]. IEEE Canadian Conference on Electrical and Computer Engineering (CCECE 2008), Niagara Falls, Ont.. Lien externe
Norman, R., Valorge, O., Blaquière, Y., Lepercq, É., Basile-Bellavance, Y., El-Alaoui, Y., Prytula, R., & Savaria, Y. (juin 2008). An active reconfigurable circuit board [Communication écrite]. Joint IEEE North-East Workshop on Circuits and Systems and TAISA Conference (NEWCAS-TAISA 2008), Montréal, QC, Canada. Lien externe
Valorge, O., Nguyen, A. T., Blaquière, Y., Norman, R., & Savaria, Y. (août 2008). Digital signal propagation on a wafer-scale smart active programmable interconnect [Communication écrite]. 15th IEEE International Conference on Electronics, Circuits and Systems (ICECS 2008), St. Julian's, Malta. Lien externe
