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Fortin, V., Gujrathi, S. C., Gagnon, G., Gauvin, R., Currie, J. F., Ouellet, L., & Tremblay, Y. (1999). Effect of in Situ Plasma Oxidation of Tin Diffusion Barrier for Alsicu/Tin/Ti Metallization Structure of Integrated Circuits. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 17(2), 423-431. Lien externe
Hajek, V., Rusnak, K., Vlcek, J., Martinu, L., & Gujrathi, S. C. (1999). Influence of substrate bias voltage on the properties of CNₓ films prepared by reactive magnetron sputtering. Journal of vacuum science and technology. A, Vacuum, surfaces, and films, 17(3), 899-908. Lien externe
