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Czeremuszkin, G., Martinu, L., Alptekin, A., Popovici, D., & Sacher, E. (mai 1997). Thermal stability of low permittivity fluoropolymer dielectrics [Communication écrite]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Non disponible
Popovici, D., Meunier, M., & Sacher, E. (mai 1997). Copper/teflon AF1600 interface interactions for multilevel interconnect applications [Communication écrite]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Non disponible
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (1997). Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices. Microelectronic Engineering, 33(1-4), 217-221. Lien externe
Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Sacher, E., Meunier, M., & Martinu, L. (juin 1996). Proceedings of the 1996 E-MRS Spring Conference [Communication écrite]. E-MRS Spring Conference, Strasbourg, Fr. Lien externe
