<  Back to the Polytechnique Montréal portal

Evolution of Mechanical Stresses in Extruded (Bi₁₋ₓSbₓ)₂(Te₁₋ySey)₃ Thermoelectric Alloys subjected to Thermal Shocks present in Module Fabrication Processes

R. Pelletier, Sylvain Turenne, A. Moreau, Dimitri Vasilevskiy and Rémo A. Masut

Paper (2007)

An external link is available for this item
Research Center: CREPEC - Center for Applied Research on Polymers and Composites
Funders: Natural Sciences and Engineering Research Council of Canada (NSERC)
ISBN: 9781424422623
PolyPublie URL: https://publications.polymtl.ca/75786/
Conference Title: International Conference on Thermoelectrics 2007
Conference Location: Jeju, Korea (South)
Conference Date(s): 2007-06-03 - 2007-06-07
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ict.2007.4569421
Official URL: https://doi.org/10.1109/ict.2007.4569421
Date Deposited: 30 Mar 2026 16:47
Last Modified: 30 Mar 2026 16:47
Cite in APA 7: Pelletier, R., Turenne, S., Moreau, A., Vasilevskiy, D., & Masut, R. A. (2007, June). Evolution of Mechanical Stresses in Extruded (Bi₁₋ₓSbₓ)₂(Te₁₋ySey)₃ Thermoelectric Alloys subjected to Thermal Shocks present in Module Fabrication Processes [Paper]. International Conference on Thermoelectrics 2007, Jeju, Korea (South). https://doi.org/10.1109/ict.2007.4569421

Statistics

Dimensions

Repository Staff Only

View Item View Item