Amir H. Nobari, Arslane A. Bouchemit, Ana Da Silva Marques, Sylvain St-Laurent and Gilles L'Espérance
Article (2018)
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| Department: | Department of Mathematics and Industrial Engineering |
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| Research Center: | (CM)² - Centre for Characterization and Microscopy of Materials |
| PolyPublie URL: | https://publications.polymtl.ca/70815/ |
| Conference Title: | SMTA International 2018 |
| Conference Location: | Chicago, IL, USA |
| Conference Date(s): | 2018-10-14 |
| Journal Title: | SMTA International (vol. 20, no. 1) |
| Publisher: | SMTA |
| DOI: | 10.37665/smxlubc61231 |
| Official URL: | https://doi.org/10.37665/smxlubc61231 |
| Date Deposited: | 22 Dec 2025 09:48 |
| Last Modified: | 22 Dec 2025 09:52 |
| Cite in APA 7: | Nobari, A. H., Bouchemit, A. A., Da Silva Marques, A., St-Laurent, S., & L'Espérance, G. (2018). Solder Powder Characteristics and Their Impact on Rheological Behavior of Solder Pastes. SMTA International, 20(1). Presented at SMTA International 2018, Chicago, IL, USA. https://doi.org/10.37665/smxlubc61231 |
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