Éric V. Sempels, Roger Kempers and Frédéric J. Lesage
Article (2016)
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| Department: | Department of Mechanical Engineering |
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| Funders: | NSERC |
| Grant number: | RGPIN-2015-05242 |
| PolyPublie URL: | https://publications.polymtl.ca/69058/ |
| Journal Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 6, no. 1) |
| Publisher: | Institute of Electrical and Electronics Engineers |
| DOI: | 10.1109/tcpmt.2015.2501321 |
| Official URL: | https://doi.org/10.1109/tcpmt.2015.2501321 |
| Date Deposited: | 09 Oct 2025 16:38 |
| Last Modified: | 09 Oct 2025 16:38 |
| Cite in APA 7: | Sempels, É. V., Kempers, R., & Lesage, F. J. (2016). Load-bearing figure-of-merit characterization of a thermoelectric module. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6(1), 50-57. https://doi.org/10.1109/tcpmt.2015.2501321 |
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