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Coherent X-ray diffraction imaging and characterization of strain in silicon-on-insulator nanostructures

G. Xiong, Oussama Moutanabbir, M. Reiche, R. Harder et I. Robinson

Article de revue (2014)

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Abstract

Coherent X-ray diffraction imaging (CDI) has emerged in the last decade as a promising high resolution lens-less imaging approach for the characterization of various samples. It has made significant technical progress through developments in source, algorithm and imaging methodologies thus enabling important scientific breakthroughs in a broad range of disciplines. In this report, we will introduce the principles of forward scattering CDI and Bragg geometry CDI (BCDI), with an emphasis on the latter. BCDI exploits the ultra-high sensitivity of the diffraction pattern to the distortions of crystalline lattice. Its ability of imaging strain on the nanometer scale in three dimensions is highly novel. We will present the latest progress on the application of BCDI in investigating the strain relaxation behavior in nanoscale patterned strained silicon-on-insulator (sSOI) materials, aiming to understand and engineer strain for the design and implementation of new generation semiconductor devices.

Mots clés

coherent X-ray diffraction Imaging; nanowire; silicon-on-Insulator; strain; ultrathin layer

Département: Département de génie physique
Organismes subventionnaires: European Research Council as an FP7 Advanced grant “Nanosculpture", I-Halle by the German Federal Ministry of Education and Research in the framework of the DECISIF project
Numéro de subvention: 27711, 3 N 9881
URL de PolyPublie: https://publications.polymtl.ca/5174/
Titre de la revue: Advanced Materials (vol. 26, no 46)
Maison d'édition: Wiley‐Blackwell
DOI: 10.1002/adma.201304511
URL officielle: https://doi.org/10.1002/adma.201304511
Date du dépôt: 08 avr. 2022 11:16
Dernière modification: 08 avr. 2024 10:29
Citer en APA 7: Xiong, G., Moutanabbir, O., Reiche, M., Harder, R., & Robinson, I. (2014). Coherent X-ray diffraction imaging and characterization of strain in silicon-on-insulator nanostructures. Advanced Materials, 26(46), 7747-7763. https://doi.org/10.1002/adma.201304511

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