Effect of crystal orientation on indentation-induced residual stress field: Simulation and experimental validation

Experimental determination of local residual stress fields beneath a spherical indent on a 001 copper single crystal revealed the presence of a significant tensile residual stress zone. This finding was adequately reproduced by Crystal Plasticity Finite Element simulations. Further simulations of one spherical indent on many other crystal orientations showed a strong variation of the residual stress field with crystal orientation. Accumulative effects of five superposing indents were simulated on two extreme orientations 001 and 111. The simulations showed that plastic anisotropy is responsible for potentially uneven compressive residual stresses after surface mechanical treatments.

Mots clés

High Angular Resolution Electron, Back-Scattered diffraction, Crystal plasticity finite element, Single crystal, Shot-peening