Julien Hautcoeur, Khelifa Hettak, Larbi Talbi, Mourad Nedil, Jafar Shaker and Ke Wu
Article (2017)
An external link is available for this item| Department: | Department of Electrical Engineering |
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| Research Center: | POLY-GRAMES - Advanced Research Centre in Microwaves and Space Electronics |
| PolyPublie URL: | https://publications.polymtl.ca/38456/ |
| Journal Title: | IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 7, no. 7) |
| Publisher: | IEEE |
| DOI: | 10.1109/tcpmt.2017.2706089 |
| Official URL: | https://doi.org/10.1109/tcpmt.2017.2706089 |
| Date Deposited: | 18 Apr 2023 15:04 |
| Last Modified: | 25 Sep 2024 16:22 |
| Cite in APA 7: | Hautcoeur, J., Hettak, K., Talbi, L., Nedil, M., Shaker, J., & Wu, K. (2017). A Novel Two-Layer Low-Profile 23-GHz Microstrip Array Fed by Slots in an SIW for Wireless Backhauling Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(7), 1126-1135. https://doi.org/10.1109/tcpmt.2017.2706089 |
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