<  Back to the Polytechnique Montréal portal

A Novel Two-Layer Low-Profile 23-GHz Microstrip Array Fed by Slots in an SIW for Wireless Backhauling Applications

Julien Hautcoeur, Khelifa Hettak, Larbi Talbi, Mourad Nedil, Jafar Shaker and Ke Wu

Article (2017)

An external link is available for this item
Department: Department of Electrical Engineering
Research Center: POLY-GRAMES - Advanced Research Centre in Microwaves and Space Electronics
PolyPublie URL: https://publications.polymtl.ca/38456/
Journal Title: IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 7, no. 7)
Publisher: IEEE
DOI: 10.1109/tcpmt.2017.2706089
Official URL: https://doi.org/10.1109/tcpmt.2017.2706089
Date Deposited: 18 Apr 2023 15:04
Last Modified: 25 Sep 2024 16:22
Cite in APA 7: Hautcoeur, J., Hettak, K., Talbi, L., Nedil, M., Shaker, J., & Wu, K. (2017). A Novel Two-Layer Low-Profile 23-GHz Microstrip Array Fed by Slots in an SIW for Wireless Backhauling Applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(7), 1126-1135. https://doi.org/10.1109/tcpmt.2017.2706089

Statistics

Dimensions

Repository Staff Only

View Item View Item