Multilayer integration and packaging on substrate integrated waveguide for next generation wireless applications

Tarek Djerafi and Ke Wu

Paper (2016)

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Department:	Department of Electrical Engineering
PolyPublie URL:	https://publications.polymtl.ca/36458/
Conference Title:	46th European Microwave Conference (EuMC 2016)
Conference Location:	London, UK
Conference Date(s):	2016-10-04 - 2016-10-06
Publisher:	IEEE
DOI:	10.1109/eumc.2016.7824479
Official URL:	https://doi.org/10.1109/eumc.2016.7824479
Date Deposited:	18 Apr 2023 15:05
Last Modified:	08 Apr 2025 12:21

Cite in APA 7:	Djerafi, T., & Wu, K. (2016, October). Multilayer integration and packaging on substrate integrated waveguide for next generation wireless applications [Paper]. 46th European Microwave Conference (EuMC 2016), London, UK. https://doi.org/10.1109/eumc.2016.7824479
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