Xiaohong Jiang, Ke Wu, Wei Hong and Wayne Wei-Ming Dai
Paper (1997)
This item is not archived in PolyPublie| Additional Information: | Nom historique du département: Département de génie électrique et de génie informatique |
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| Department: |
Department of Electrical Engineering Department of Computer Engineering and Software Engineering |
| PolyPublie URL: | https://publications.polymtl.ca/30369/ |
| Conference Title: | IEEE Multi-Chip Module Conference |
| Conference Location: | Santa Cruz, CA, USA |
| Conference Date(s): | 1997-02-04 - 1997-02-05 |
| Date Deposited: | 18 Apr 2023 15:23 |
| Last Modified: | 25 Sep 2024 16:12 |
| Cite in APA 7: | Jiang, X., Wu, K., Hong, W., & Dai, W. W.-M. (1997, February). Proceedings of the 1997 IEEE Multi-Chip Module Conference [Paper]. IEEE Multi-Chip Module Conference, Santa Cruz, CA, USA. |
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