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Proceedings of the 1997 IEEE Multi-Chip Module Conference

Xiaohong Jiang, Ke Wu, Wei Hong and Wayne Wei-Ming Dai

Paper (1997)

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Additional Information: Nom historique du département: Département de génie électrique et de génie informatique
Department: Department of Electrical Engineering
Department of Computer Engineering and Software Engineering
PolyPublie URL: https://publications.polymtl.ca/30369/
Conference Title: IEEE Multi-Chip Module Conference
Conference Location: Santa Cruz, CA, USA
Conference Date(s): 1997-02-04 - 1997-02-05
Date Deposited: 18 Apr 2023 15:23
Last Modified: 25 Sep 2024 16:12
Cite in APA 7: Jiang, X., Wu, K., Hong, W., & Dai, W. W.-M. (1997, February). Proceedings of the 1997 IEEE Multi-Chip Module Conference [Paper]. IEEE Multi-Chip Module Conference, Santa Cruz, CA, USA.

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