Jiang Xiaohong, Ke Wu, Hong Wei and W. W.-M. Dai
Paper (1997)
An external link is available for this itemAdditional Information: | Nom historique du département: Département de génie électrique et de génie informatique |
---|---|
Department: |
Department of Electrical Engineering Department of Computer Engineering and Software Engineering |
PolyPublie URL: | https://publications.polymtl.ca/29972/ |
Conference Title: | IEEE Multi-Chip Module Conference |
Conference Location: | Santa Cruz, CA, USA |
Conference Date(s): | 1997-02-04 - 1997-02-05 |
Publisher: | IEEE Comput. Soc. Press |
DOI: | 10.1109/mcmc.1997.569351 |
Official URL: | https://doi.org/10.1109/mcmc.1997.569351 |
Date Deposited: | 18 Apr 2023 15:23 |
Last Modified: | 25 Sep 2024 16:11 |
Cite in APA 7: | Xiaohong, J., Wu, K., Wei, H., & Dai, W. W.-M. (1997, February). Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines [Paper]. IEEE Multi-Chip Module Conference, Santa Cruz, CA, USA. https://doi.org/10.1109/mcmc.1997.569351 |
---|---|
Statistics
Dimensions