The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering

D. Popovici, Jolanta-Ewa Sapieha , G. Czeremuszkin, A. Alptekin, Ludvik Martinu , Michel Meunier et Edward Sacher

Communication écrite (1998)

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Renseignements supplémentaires:	Nom historique du département: Département de génie physique et de génie des matériaux
Département:	Département de génie physique
URL de PolyPublie:	https://publications.polymtl.ca/29406/
Nom de la conférence:	Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris)
Maison d'édition:	VSP
DOI:	10.1201/b11958-26
URL officielle:	https://doi.org/10.1201/b11958-26
Date du dépôt:	18 avr. 2023 15:23
Dernière modification:	25 sept. 2024 16:10

Citer en APA 7:	Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Alptekin, A., Martinu, L., Meunier, M., & Sacher, E. The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering [Communication écrite]. Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris). https://doi.org/10.1201/b11958-26

Citer en APA 7:

Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Alptekin, A., Martinu, L., Meunier, M., & Sacher, E. The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering [Communication écrite]. Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris). https://doi.org/10.1201/b11958-26

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