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Design models for three-dimensional millimeter-wave planar/non-planar integrated circuits: new opportunities and tough challenges

Ke Wu

Paper (1998)

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Additional Information: Nom historique du département: Département de génie électrique et de génie informatique
Department: Department of Electrical Engineering
Department of Computer Engineering and Software Engineering
PolyPublie URL: https://publications.polymtl.ca/29243/
Conference Title: 3rd RIEC International Symposium on Novel Technique and Applications of Millimeter-Waves
Conference Location: Sendai, Japan
Conference Date(s): 1998-01-01 - 1998-12-31
Date Deposited: 18 Apr 2023 15:23
Last Modified: 25 Sep 2024 16:10
Cite in APA 7: Wu, K. (1998, January). Design models for three-dimensional millimeter-wave planar/non-planar integrated circuits: new opportunities and tough challenges [Paper]. 3rd RIEC International Symposium on Novel Technique and Applications of Millimeter-Waves, Sendai, Japan.

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