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FMI applied to the study of the temperature distribution in flip chips

Nicolas Boyer, D. P. Masson, Michel Meunier and M. Simard-Normandin

Paper (1999)

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Additional Information: Nom historique du département: Département de génie physique et de génie des matériaux
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/29083/
Conference Title: 15th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 1999)
Conference Location: San Diego, CA, USA
Conference Date(s): 1999-03-09 - 1999-03-11
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/stherm.1999.762444
Official URL: https://doi.org/10.1109/stherm.1999.762444
Date Deposited: 18 Apr 2023 15:22
Last Modified: 05 Apr 2024 11:17
Cite in APA 7: Boyer, N., Masson, D. P., Meunier, M., & Simard-Normandin, M. (1999, March). FMI applied to the study of the temperature distribution in flip chips [Paper]. 15th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 1999), San Diego, CA, USA. https://doi.org/10.1109/stherm.1999.762444

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