Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave and millimeter-wave circuits

J. B. Tang and Ke Wu

Paper (1999)

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Additional Information:	Nom historique du département: Département de génie électrique et de génie informatique
Department:	Department of Electrical Engineering Department of Computer Engineering and Software Engineering
ISBN:	0780357612
PolyPublie URL:	https://publications.polymtl.ca/28566/
Conference Title:	Asia-Pacific Microwave Conference (APMC 1999)
Conference Location:	Singapore
Conference Date(s):	1999-11-30 - 1999-12-03
Publisher:	IEEE
DOI:	10.1109/apmc.1999.828063
Official URL:	https://doi.org/10.1109/apmc.1999.828063
Date Deposited:	18 Apr 2023 15:22
Last Modified:	25 Sep 2024 16:09

Cite in APA 7:	Tang, J. B., & Wu, K. (1999, November). Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave and millimeter-wave circuits [Paper]. Asia-Pacific Microwave Conference (APMC 1999), Singapore. https://doi.org/10.1109/apmc.1999.828063
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