D.-Q. Yang, S. Poulin, Edward Sacher and C. Hyett
Article (2000)
An external link is available for this item| Additional Information: | Nom historique du département: Département de génie physique et de génie des matériaux |
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| Department: | Department of Engineering Physics |
| Research Center: | GCM - Thin Film Physics and Technology Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/27722/ |
| Journal Title: | Applied Surface Science (vol. 165, no. 2-3) |
| Publisher: | Elsevier |
| DOI: | 10.1016/s0169-4332(00)00372-x |
| Official URL: | https://doi.org/10.1016/s0169-4332%2800%2900372-x |
| Date Deposited: | 18 Apr 2023 15:22 |
| Last Modified: | 08 Apr 2025 02:17 |
| Cite in APA 7: | Yang, D.-Q., Poulin, S., Sacher, E., & Hyett, C. (2000). Interfacial reaction between evaporated copper and Dow Cyclotene 3022. Applied Surface Science, 165(2-3), 116-126. https://doi.org/10.1016/s0169-4332%2800%2900372-x |
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