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Interfacial reaction between evaporated copper and Dow Cyclotene 3022

D.-Q. Yang, S. Poulin, Edward Sacher and C. Hyett

Article (2000)

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Additional Information: Nom historique du département: Département de génie physique et de génie des matériaux
Department: Department of Engineering Physics
Research Center: GCM - Thin Film Physics and Technology Research Group
PolyPublie URL: https://publications.polymtl.ca/27722/
Journal Title: Applied Surface Science (vol. 165, no. 2-3)
Publisher: Elsevier
DOI: 10.1016/s0169-4332(00)00372-x
Official URL: https://doi.org/10.1016/s0169-4332%2800%2900372-x
Date Deposited: 18 Apr 2023 15:22
Last Modified: 05 Apr 2024 11:15
Cite in APA 7: Yang, D.-Q., Poulin, S., Sacher, E., & Hyett, C. (2000). Interfacial reaction between evaporated copper and Dow Cyclotene 3022. Applied Surface Science, 165(2-3), 116-126. https://doi.org/10.1016/s0169-4332%2800%2900372-x

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