Catherine Billotte, Pierre Carreau
and Marie-Claude Heuzey
Article (2006)
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| Department: | Department of Chemical Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/23357/ |
| Journal Title: | Rheologica Acta (vol. 45, no. 4) |
| Publisher: | Springer |
| DOI: | 10.1007/s00397-005-0053-3 |
| Official URL: | https://doi.org/10.1007/s00397-005-0053-3 |
| Date Deposited: | 18 Apr 2023 15:17 |
| Last Modified: | 25 Sep 2024 16:02 |
| Cite in APA 7: | Billotte, C., Carreau, P., & Heuzey, M.-C. (2006). Rheological characterization of a solder paste for surface mount applications. Rheologica Acta, 45(4), 374-386. https://doi.org/10.1007/s00397-005-0053-3 |
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