Substrate integrated circuits (SICs) for low-cost high-density integration of millimeter-wave wireless systems

Ke Wu

Paper (2008)

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Department:	Department of Electrical Engineering
Research Center:	POLY-GRAMES - Advanced Research Centre in Microwaves and Space Electronics
PolyPublie URL:	https://publications.polymtl.ca/20127/
Conference Title:	IEEE Radio and Wireless Symposium (RWS 2008)
Conference Location:	Orlando, FL, USA
Conference Date(s):	2008-01-22 - 2008-01-24
Publisher:	IEEE
DOI:	10.1109/rws.2008.4463584
Official URL:	https://doi.org/10.1109/rws.2008.4463584
Date Deposited:	18 Apr 2023 15:16
Last Modified:	25 Sep 2024 15:58

Cite in APA 7:	Wu, K. (2008, January). Substrate integrated circuits (SICs) for low-cost high-density integration of millimeter-wave wireless systems [Paper]. IEEE Radio and Wireless Symposium (RWS 2008), Orlando, FL, USA. https://doi.org/10.1109/rws.2008.4463584
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