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Substrate-integrated waveguide vertical interconnects for 3-D integrated circuits

Bassel Youzkatli El Khatib, Tarek Djerafi and Ke Wu

Article (2012)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/15448/
Journal Title: IEEE Transactions on Components, Packaging and Manufacturing Technology (vol. 2, no. 9)
Publisher: IEEE
DOI: 10.1109/tcpmt.2012.2196516
Official URL: https://doi.org/10.1109/tcpmt.2012.2196516
Date Deposited: 18 Apr 2023 15:10
Last Modified: 05 Apr 2024 10:56
Cite in APA 7: El Khatib, B. Y., Djerafi, T., & Wu, K. (2012). Substrate-integrated waveguide vertical interconnects for 3-D integrated circuits. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2(9), 1526-1535. https://doi.org/10.1109/tcpmt.2012.2196516

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