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SIW 90-degree twist for substrate integrated circuits and systems

A. Doghri, T. Djerafi, A. Ghiotto and Ke Wu

Paper (2013)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/14004/
Conference Title: IEEE MTT-S International Microwave Symposium (IMS 2013)
Conference Location: Seattle, Wash., USA
Conference Date(s): 2013-06-02 - 2013-06-07
Publisher: IEEE
DOI: 10.1109/mwsym.2013.6697770
Official URL: https://doi.org/10.1109/mwsym.2013.6697770
Date Deposited: 18 Apr 2023 15:09
Last Modified: 05 Apr 2024 10:54
Cite in APA 7: Doghri, A., Djerafi, T., Ghiotto, A., & Wu, K. (2013, June). SIW 90-degree twist for substrate integrated circuits and systems [Paper]. IEEE MTT-S International Microwave Symposium (IMS 2013), Seattle, Wash., USA (3 pages). https://doi.org/10.1109/mwsym.2013.6697770

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