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Zeb, G., Nguyen, T. D., Giang, T. P. L., & Le, X. T. (2024). Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO2 for High Aspect Ratio Through-Silicon Via Technology in 3D Integration. ACS Applied Electronic Materials, 00062 (8 pages). Lien externe
