Documents publiés en "2018"

Nobari, A. H., Bouchemit, A. A., Da Silva Marques, A., St-Laurent, S., & L'Espérance, G. (2018). Solder Powder Characteristics and Their Impact on Rheological Behavior of Solder Pastes. SMTA International, 20(1). Présentée à SMTA International 2018, Chicago, IL, USA. Lien externe

Nobari, A. H., St-Laurent, S., Thomas, Y., Bouchemit, A., & L'Espérance, G. (mai 2018). Performance of fine and ultra-fine lead-free powders for solder paste applications [Communication écrite]. 68th IEEE Electronic Components and Technology Conference (ECTC 2018), San Diego, CA. Lien externe