Documents publiés en "2011"

Communication écrite

Ding, Y., Kwark, Y. H., Shan, L., Baks, C., & Wu, K. (mai 2011). Techniques for de-embedding a high port count connector to PCB via interposer [Communication écrite]. 61st Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL, United states. Lien externe

Thèse de doctorat

Ding, Y. (2011). Miniaturization Techniques of Substrate Integrated Waveguide Based on Multilayered Printed Circuit Board Platform [Thèse de doctorat, École Polytechnique de Montréal]. Disponible