Documents publiés en "2006"

Département de génie physique

Yang, D. Q., & Sacher, E. (janvier 2006). The loss of Adhesion of an nanoparticles to the Silicon Wafer Surface During N,N-Dimethyl Formamide(DMF) Evaporation : Understanding the Process Involved [Communication écrite]. 29th annual meeting of the adhesion society, Blacksburg, Va. Non disponible