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Billotte, C., Carreau, P., & Heuzey, M.-C. (2006). Rheological characterization of a solder paste for surface mount applications. Rheologica Acta, 45(4), 374-386. Lien externe
Ruiz, E., Waffo, F., Owens, J., Billotte, C., & Trochu, F. (juillet 2006). Modeling of Resin Cure Kinetics for mOlding Cycle Optimization [Communication écrite]. 8th International Conference on Flow Processes in Composite Materials, Mines de Douai, France. Lien externe
