Documents publiés en "1999"

Département de génie électrique

Fortin, V., Gujrathi, S. C., Gagnon, G., Gauvin, R., Currie, J. F., Ouellet, L., & Tremblay, Y. (1999). Effect of in Situ Plasma Oxidation of Tin Diffusion Barrier for Alsicu/Tin/Ti Metallization Structure of Integrated Circuits. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 17(2), 423-431. Lien externe

Renault, O., Briand, D., Delabouglise, G., Currie, J. F., & Labeau, M. (1999). Integration of a Sensitive Material to a Silicon-Based Device for Co Detection. Sensors and Actuators. A, Physical, 74(1-3), 225-228. Lien externe

Département de génie informatique et génie logiciel

Fortin, V., Gujrathi, S. C., Gagnon, G., Gauvin, R., Currie, J. F., Ouellet, L., & Tremblay, Y. (1999). Effect of in Situ Plasma Oxidation of Tin Diffusion Barrier for Alsicu/Tin/Ti Metallization Structure of Integrated Circuits. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 17(2), 423-431. Lien externe

Renault, O., Briand, D., Delabouglise, G., Currie, J. F., & Labeau, M. (1999). Integration of a Sensitive Material to a Silicon-Based Device for Co Detection. Sensors and Actuators. A, Physical, 74(1-3), 225-228. Lien externe

Département de génie mécanique

Fortin, V., Gujrathi, S. C., Gagnon, G., Gauvin, R., Currie, J. F., Ouellet, L., & Tremblay, Y. (1999). Effect of in Situ Plasma Oxidation of Tin Diffusion Barrier for Alsicu/Tin/Ti Metallization Structure of Integrated Circuits. Journal of vacuum science & technology. B. Microelectronics and nanometer structures processing, measurement and phenomena, 17(2), 423-431. Lien externe

Département de génie physique

Currie, J. F., & Sundararaman, C. S. (1999). Field effect devices. (Brevet no US5986291). Lien externe

Currie, J. F., Essalik, A., & Marusic, J. C. (1999). Micromachined Thin Film Solid State Electrochemical CO₂, NO₂ and SO₂ Gas Sensors. Sensors and Actuators. B, Chemical, 59(2-3), 235-241. Lien externe