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Documents dont l'auteur est "Parment, Frederic"

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Nombre de documents: 8

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Ghiotto, A., Doghri, A., Parment, F., Djerafi, T., Vuong, T.-P., & Wu, K. (mai 2015). Three-dimensional SIW and high-performance air-filled SIW for millimeter-wave substrate integrated circuits and systems [Communication écrite]. Global Symposium on Millimeter Waves (GSMM 2015), Montréal, Québec (3 pages). Lien externe

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Nguyen, N.-H., Ghiotto, A., Vuong, T.-P., Vilcot, A., Parment, F., & Wu, K. (juin 2018). Slab Air-Filled Substrate Integrated Waveguide [Communication écrite]. IEEE/MTT-S International Microwave Symposium (IMS 2018), Philadelphia, PA. Lien externe

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Parment, F., Ghiotto, A., Vuong, T.-P., Duchamp, J.-M., & Wu, K. (2017). Air-to-Dielectric-Filled Two-Hole Substrate-Integrated Waveguide Directional Coupler. IEEE Microwave and Wireless Components Letters, 27(7), 621-623. Lien externe

Parment, F., Ghiotto, A., Vuong, T.-P., Carpentier, L., & Wu, K. (juin 2017). Substrate integrated suspended line to air-filled SIW transition for high-performance millimeter-wave multilayer integration [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2017), Honolulu, HI, United states. Lien externe

Parment, F., Ghiotto, A., Vuong, T.-P., Duchamp, J.-M., & Wu, K. (mai 2016). Broadband directional Moreno coupler for high-performance air-filled SIW-based Substrate Integrated Systems [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2016), San Francisco, CA, United states. Lien externe

Parment, F., Ghiotto, A., Vuong, T.-P., Duchamp, J.-M., & Wu, K. (mai 2015). Air-filled SIW transmission line and phase shifter for high-performance and low-cost U-Band integrated circuits and systems [Communication écrite]. Global Symposium on Millimeter Waves (GSMM 2015), Montréal, Québec (3 pages). Lien externe

Parment, F., Ghiotto, A., Vuong, T.-P., Duchamp, J.-M., & Wu, K. (septembre 2015). Low-loss air-filled Substrate Integrated Waveguide (SIW) band-pass filter with inductive posts [Communication écrite]. 45th European Microwave Conference (EuMC 2015), Paris, France. Lien externe

Parment, F., Ghiotto, A., Vuong, T.-P., Duchamp, J.-M., & Wu, K. (juin 2014). Broadband transition from dielectric-filled to air-filled substrate integrated waveguide for low loss and high power handling millimeter-wave substrate integrated circuits [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2014), Tampa Bay, Florida, USA. Lien externe

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