 | Up a level |
Altoobaji, I. (2024). A Compact Highly Integrated Data Communication System for On-Chip Digital Isolator [Ph.D. thesis, Polytechnique Montréal]. Restricted access
Altoobaji, I., Hassan, A., Ali, M., Nabavi, M., Audet, Y., & Lakhssassi, A. (2023). A Fully Integrated 0.6 Gbps Data Communication System for Inductive-Based Digital Isolator with 0.8 ns Propagation Delay and 10(-15) BER. Electronics, 12(15), 3336 (15 pages). External link
Altoobaji, I., Hassan, A., Ali, M., Audet, Y., & Lakhssassi, A. (2023). A Low-Power 0.68-Gbps Data Communication System for Capacitive Digital Isolator With 1.9-ns Propagation Delay. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 5 pages. External link
Altoobaji, I., Ali, M., Hassan, A., Audet, Y., & Lakhssassi, A. (2021, June). A High Speed Fully Integrated Capacitive Digital Isolation System in 0.35 m CMOS for Industrial Sensor Interfaces [Paper]. 19th IEEE International New Circuits and Systems Conference (NEWCAS 2021), Toulon, France (4 pages). External link
Altoobaji, I., Ali, M., Hassan, A., Nabavi, M., Audet, Y., & Lakhssassi, A. (2020, August). A Fully Integrated On-Chip Inductive Digital Isolator: Design Investigation and Simulation [Paper]. 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS 2020), Springfield, MA, USA. External link
