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Analysis of copper/fluoropolymer film systems for multilevel interconnects

Avni Alptekin

Masters thesis (1998)

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Cite this document: Alptekin, A. (1998). Analysis of copper/fluoropolymer film systems for multilevel interconnects (Masters thesis, École Polytechnique de Montréal). Retrieved from https://publications.polymtl.ca/6754/
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Characteristics of film materials considered for multilevel interconnects -- Structure and dielectric properties of fluoropolymer films -- Properties of copper films -- Adhesion of metals to fluoropolymers -- Experimental methodology -- Fabrication of fluoropolymer films -- Fabrication of copper films -- Characterization of film materials -- Dielectric properties of fluoropolymer films -- Adhesion of copper to fluoropolymers.

Open Access document in PolyPublie
Additional Information: Le fichier PDF de ce document a été produit par Bibliothèque et Archives Canada selon les termes du programme Thèses Canada https://canada.on.worldcat.org/oclc/46574922
Department: Département de génie physique
Date Deposited: 04 Aug 2021 11:05
Last Modified: 25 Aug 2021 14:57
PolyPublie URL: https://publications.polymtl.ca/6754/


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