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Kinematic Synthesis for 3D Signatures

Moises Diaz, Miguel A. Ferrer, Cristina Carmona-Duarte, Jose Juan Quintana, Aythami Morales, Julian Fierrez and Réjean Plamondon

Paper (2022)

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Department: Department of Electrical Engineering
PolyPublie URL: https://publications.polymtl.ca/52573/
Conference Title: IEEE International Joint Conference on Biometrics (IJCB 2022)
Conference Location: Abu Dhabi, United Arab Emirates
Conference Date(s): 2022-10-10 - 2022-10-13
Publisher: IEEE
DOI: 10.1109/ijcb54206.2022.10007945
Official URL: https://doi.org/10.1109/ijcb54206.2022.10007945
Date Deposited: 18 Apr 2023 14:58
Last Modified: 05 Apr 2024 11:57
Cite in APA 7: Diaz, M., Ferrer, M. A., Carmona-Duarte, C., Quintana, J. J., Morales, A., Fierrez, J., & Plamondon, R. (2022, October). Kinematic Synthesis for 3D Signatures [Paper]. IEEE International Joint Conference on Biometrics (IJCB 2022), Abu Dhabi, United Arab Emirates (7 pages). https://doi.org/10.1109/ijcb54206.2022.10007945

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