Moises Díaz, Miguel A. Ferrer, Cristina Carmona-Duarte, Jose Juan Quintana, Aythami Morales, Julián Fiérrez and Réjean Plamondon
Paper (2022)
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| Department: | Department of Electrical Engineering |
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| ISBN: | 9781665463942 |
| PolyPublie URL: | https://publications.polymtl.ca/52573/ |
| Conference Title: | IEEE International Joint Conference on Biometrics (IJCB 2022) |
| Conference Location: | Abu Dhabi, United Arab Emirates |
| Conference Date(s): | 2022-10-10 - 2022-10-13 |
| Publisher: | IEEE |
| DOI: | 10.1109/ijcb54206.2022.10007945 |
| Official URL: | https://doi.org/10.1109/ijcb54206.2022.10007945 |
| Date Deposited: | 18 Apr 2023 14:58 |
| Last Modified: | 08 Apr 2025 14:40 |
| Cite in APA 7: | Díaz, M., Ferrer, M. A., Carmona-Duarte, C., Quintana, J. J., Morales, A., Fiérrez, J., & Plamondon, R. (2022, October). Kinematic Synthesis for 3D Signatures [Paper]. IEEE International Joint Conference on Biometrics (IJCB 2022), Abu Dhabi, United Arab Emirates (7 pages). https://doi.org/10.1109/ijcb54206.2022.10007945 |
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