Simon Gelin, Delphine Poinot, Sebastien Chatel, Pierre-Jean Calba and Anael Lemaitre
Article (2019)
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| Department: | Department of Mathematics and Industrial Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/43634/ |
| Journal Title: | Physical Review Materials (vol. 3, no. 5) |
| Publisher: | American Physical Society |
| DOI: | 10.1103/physrevmaterials.3.055608 |
| Official URL: | https://doi.org/10.1103/physrevmaterials.3.055608 |
| Date Deposited: | 18 Apr 2023 15:01 |
| Last Modified: | 08 Apr 2025 07:08 |
| Cite in APA 7: | Gelin, S., Poinot, D., Chatel, S., Calba, P.-J., & Lemaitre, A. (2019). Microstructural origin of compressive in situ stresses in electron-gun-evaporated silica thin films. Physical Review Materials, 3(5), 055608 (19 pages). https://doi.org/10.1103/physrevmaterials.3.055608 |
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