De Quan Yang and Edward Sacher
Article (2001)
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| Additional Information: | Nom historique du département: Département de génie physique et de génie des matériaux |
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| Department: | Department of Engineering Physics |
| Research Center: | GCM - Thin Film Physics and Technology Research Group |
| PolyPublie URL: | https://publications.polymtl.ca/26937/ |
| Journal Title: | Applied Surface Science (vol. 173, no. 1-2) |
| Publisher: | Elsevier |
| DOI: | 10.1016/s0169-4332(00)00882-5 |
| Official URL: | https://doi.org/10.1016/s0169-4332%2800%2900882-5 |
| Date Deposited: | 18 Apr 2023 15:21 |
| Last Modified: | 25 Sep 2024 16:07 |
| Cite in APA 7: | Yang, D. Q., & Sacher, E. (2001). Argon Ion Treatment of the Dow Cyclotene 3022 Surface and Its Effect on the Adhesion of Evaporated Copper. Applied Surface Science, 173(1-2), 30-40. https://doi.org/10.1016/s0169-4332%2800%2900882-5 |
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