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Argon Ion Treatment of the Dow Cyclotene 3022 Surface and Its Effect on the Adhesion of Evaporated Copper

De Quan Yang and Edward Sacher

Article (2001)

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Additional Information: Nom historique du département: Département de génie physique et de génie des matériaux
Department: Department of Engineering Physics
Research Center: GCM - Thin Film Physics and Technology Research Group
PolyPublie URL: https://publications.polymtl.ca/26937/
Journal Title: Applied Surface Science (vol. 173, no. 1-2)
Publisher: Elsevier
DOI: 10.1016/s0169-4332(00)00882-5
Official URL: https://doi.org/10.1016/s0169-4332%2800%2900882-5
Date Deposited: 18 Apr 2023 15:21
Last Modified: 05 Apr 2024 11:14
Cite in APA 7: Yang, D. Q., & Sacher, E. (2001). Argon Ion Treatment of the Dow Cyclotene 3022 Surface and Its Effect on the Adhesion of Evaporated Copper. Applied Surface Science, 173(1-2), 30-40. https://doi.org/10.1016/s0169-4332%2800%2900882-5

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