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The Enhancement of the Adhesion of Copper Layers to Dow Cyclotene 3022 Through Metal Sputtering

De Quan Yang, Edward Sacher, E. M. Griswold and G. Smith

Article (2001)

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Additional Information: Nom historique du département: Département de génie physique et de génie des matériaux
Department: Department of Engineering Physics
PolyPublie URL: https://publications.polymtl.ca/26936/
Journal Title: Applied Surface Science (vol. 180, no. 3-4)
Publisher: Elsevier
DOI: 10.1016/s0169-4332(01)00339-7
Official URL: https://doi.org/10.1016/s0169-4332%2801%2900339-7
Date Deposited: 18 Apr 2023 15:21
Last Modified: 05 Apr 2024 11:14
Cite in APA 7: Yang, D. Q., Sacher, E., Griswold, E. M., & Smith, G. (2001). The Enhancement of the Adhesion of Copper Layers to Dow Cyclotene 3022 Through Metal Sputtering. Applied Surface Science, 180(3-4), 200-208. https://doi.org/10.1016/s0169-4332%2801%2900339-7

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