Documents publiés en "2018"

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Nobari, A. H., St-Laurent, S., Thomas, Y., Bouchemit, A., & L'Espérance, G. (mai 2018). Performance of fine and ultra-fine lead-free powders for solder paste applications [Communication écrite]. 68th IEEE Electronic Components and Technology Conference (ECTC 2018), San Diego, CA. Lien externe

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Xu, C., Bouchemit, A., L'Espérance, G., Laberge Lebel, L., & Therriault, D. (mai 2018). 3D printing of metallic structures from a green ink [Communication écrite]. CSME International Congress, Toronto, Ontario, Canada. Lien externe