Documents publiés en "2018"

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Laflamme-Mayer, N., Kowarzyk, G., Blaquiere, Y., Savaria, Y., & Sawan, M. (2018). A Defect-Tolerant Reusable Network of DACs for Wafer-Scale Integration. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 27(2), 304-315. Lien externe