Documents publiés en "2016"

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Lakhssassi, A., Palenychka, R., Savaria, Y., Saydé, M., & Zaremba, M. (2016). Monitoring thermal stress in wafer-scale integrated circuits by the attentive vision method using an infrared camera. IEEE Transactions on Circuits and Systems for Video Technology, 26(2), 412-424. Lien externe